| Cooled MWIR VGA Performance Module | 640 × 512, 15 μm pixel pitch | 3.7–4.8 μm | ≤20–25 mK at 25 °C | Approximately 77 K | Up to 100 Hz full frame | Camera Link, 10GigE or CoaXPress, depending on configuration | RS-232/RS-422, Gigabit Ethernet, discrete I/O | Typically 15–30 W including cooler and electronics | Approximately 110 × 75 × 65 mm, excluding lens | Long-range surveillance, airborne payloads, target tracking | High sensitivity and spatial resolution; requires careful thermal, vibration and high-speed data design |
| Cooled MWIR VGA Low-SWaP Module | 640 × 512, 15 μm pixel pitch | 3.7–4.8 μm | ≤25–35 mK at 25 °C | Approximately 77 K | Up to 60 Hz full frame | Camera Link or GigE Vision | RS-232/RS-422, Ethernet, trigger and synchronization I/O | Typically 10–20 W including cooler and electronics | Approximately 95 × 70 × 60 mm, excluding lens | Unmanned systems, stabilized gimbals, compact defense payloads | A balanced choice where size, weight and power are more important than maximum frame rate |
| Cooled MWIR HD Research Module | 1280 × 1024, 15 μm pixel pitch | 3.7–4.8 μm | ≤20–30 mK at 25 °C | Approximately 77 K | Up to 30–60 Hz, depending on readout mode | Camera Link Full, CoaXPress or 10GigE | Ethernet, RS-232/RS-422, external clock, trigger and frame synchronization | Typically 25–45 W including cooler and processing electronics | Approximately 145 × 95 × 80 mm, excluding lens | Spectroscopy, materials research, high-resolution testing, scientific imaging | Best image detail and measurement flexibility; requires high-bandwidth acquisition and stronger thermal management |
| Cooled LWIR Industrial Module | 640 × 512, 15 μm pixel pitch | 7.7–9.3 μm | ≤20–30 mK at 25 °C | Approximately 77 K | Up to 50–100 Hz full frame | Camera Link, GigE Vision or 10GigE | Ethernet, RS-232/RS-422, analog video and alarm I/O on selected designs | Typically 15–30 W including cooler and electronics | Approximately 110 × 75 × 65 mm, excluding lens | Furnace inspection, process monitoring, predictive maintenance, gas and heat studies | Strong for low-temperature-difference measurement; verify window materials, emissivity handling and calibration support |
| Cooled SWIR InGaAs Module | 640 × 512, 15 μm pixel pitch | 0.9–1.7 μm | Typically 20–50 μm equivalent sensitivity specification | Thermoelectric or multistage cooling, commonly 200–250 K | Up to 100 Hz full frame | Camera Link, GigE Vision or USB 3.0 on compact designs | USB, Ethernet, RS-232/RS-422, trigger and synchronization I/O | Typically 5–15 W, depending on cooling method | Approximately 90 × 65 × 55 mm, excluding lens | Semiconductor inspection, sorting, laser alignment, low-light research | Lowest power option among cooled classes; it is not a direct replacement for MWIR or LWIR thermal imaging |