| 1 | Global Broad-Line Profile A | Standard CMOS, high-speed CMOS, low-voltage CMOS, buffers, inverters, flip-flop-related logic | 1.65 V to 6.0 V | Approximately 2 ns to 30 ns | SOIC, TSSOP, VSSOP, QFN, wafer-level packages | Consumer electronics, industrial controls, communication equipment, embedded systems | Broad catalog coverage and high-volume manufacturing support both legacy designs and new low-voltage platforms. |
| 2 | High-Volume CMOS Profile B | HC, HCT, AHC, AHCT, open-drain logic, bus transceivers | 2.0 V to 6.0 V | Approximately 3 ns to 25 ns | DIP, SOIC, TSSOP, PDIP, QFN | Factory automation, measurement systems, power-control interfaces, maintenance replacements | Strong support for widely used 5 V and mixed-voltage logic standards helps extend the life of established equipment. |
| 3 | Advanced Low-Voltage Profile C | LVC, AVC, AUP, voltage-level translation, bus-hold logic | 0.8 V to 3.6 V | Approximately 1 ns to 8 ns | QFN, VSSOP, TSSOP, BGA, wafer-level packages | Portable products, processors, memory interfaces, battery-powered equipment | Low-voltage operation and fast switching reduce power consumption while supporting modern processor and memory interfaces. |
| 4 | Automotive-Qualified Profile D | Automotive CMOS gates, buffers, multiplexers, translators, fail-safe input devices | 1.65 V to 5.5 V | Approximately 2 ns to 20 ns | SOIC, TSSOP, DFN, QFN, automotive-grade leaded packages | Body electronics, infotainment, driver-assistance subsystems, battery-management systems | Automotive qualification, extended temperature ratings, and process traceability are critical for safety-conscious vehicle electronics. |
| 5 | Industrial-Reliability Profile E | CMOS gates, Schmitt-trigger inputs, rugged buffers, reset logic, interface logic | 2.0 V to 5.5 V | Approximately 4 ns to 35 ns | SOIC, TSSOP, PDIP, QFN, ceramic and extended-temperature options | Industrial controllers, robotics, instrumentation, process monitoring, energy systems | Long product lifecycles, robust qualification, and stable documentation are valuable for industrial equipment that remains deployed for years. |
| 6 | Mixed-Signal Interface Profile F | Logic gates, level shifters, analog switches, translators, clock and control logic | 1.2 V to 5.5 V | Approximately 1.5 ns to 18 ns | QFN, TSSOP, VSSOP, BGA, wafer-level packages | Sensors, data-acquisition systems, medical instruments, communication interfaces | Combining logic and signal-conditioning functions can reduce board area, component count, and interface complexity. |
| 7 | Specialty High-Speed Profile G | High-speed differential logic, emitter-coupled logic, clock buffers, frequency-control devices | Approximately 2.5 V to 5.0 V | Sub-nanosecond to approximately 3 ns | QFN, TSSOP, BGA, high-frequency leadless packages | Telecommunications, test equipment, radar subsystems, high-speed data paths | Very low propagation delay and controlled signal integrity support timing-sensitive and high-frequency systems. |
| 8 | Legacy-Compatible Profile H | 74-series-compatible gates, TTL-compatible inputs, counters, latches, buffers | 4.5 V to 5.5 V for many legacy families | Approximately 5 ns to 40 ns | DIP, SOIC, PDIP, TSSOP, through-hole-compatible packages | Replacement boards, educational equipment, laboratory systems, legacy automation | Reliable availability of compatible parts helps manufacturers maintain older systems without redesigning the complete circuit. |
| 9 | Ultra-Low-Power Profile I | Sub-1.2 V logic, tiny single-gate devices, low-power buffers, miniature translators | 0.8 V to 3.6 V | Approximately 3 ns to 25 ns | DFN, X2SON, SOT-23, wafer-level packages | Wearables, wireless sensors, portable medical devices, compact battery products | Small footprints and low quiescent current are important where board space, heat, and battery capacity are limited. |
| 10 | Application-Specific Supply Profile J | Custom logic cells, radiation-tolerant logic, harsh-environment gates, qualified interface devices | Approximately 1.8 V to 5.5 V, application dependent | Approximately 2 ns to 50 ns, application dependent | Ceramic, hermetic, QFN, SOIC, specialized high-reliability packages | Aerospace, defense, energy infrastructure, scientific instruments, harsh-environment electronics | Specialized qualification, environmental tolerance, and documentation can outweigh price in mission-critical applications. |